Technology Activities For Kids

But, just in case you went and purchased untabbed cells to save cash, let's explain what has to be achieved. Firstly, you'll want to solder a tabbing strip to the "sunny-face" of each of your cells. There are two main how to do this, both fiddly. You'll solder the strip directly to the cell with flux or, pre-solder or "tin" each strip then solder it towards the mobile. The theory is to get a connection that is solid the solar mobile or you won't move current. Solar tabbing ribbon typically includes 10-15 micrometers of solder alloy, commonly SN60 (60% tin and 40% lead) covered on copper strip, note this contains lead. I would personally go without pre-soldering the tabbing strip as I'm a little lazy. Either way, apply flux towards the the big shiny strips(the coach pubs) on the front "sunny-face" associated with mobile. Lay the tabbing strip over the fluxed coach club and with a flat tipped soldering iron, run slowly down the strip. Extra fingers are good here. The tab strip will peal straight off if you did a bad job. If done very carefully, the tabbing strip shall connect towards the bus club. It is suggested exercising for a broken cell with some free strip to obtain a feel for the soldering. Since there are frequently two of these for each cell that is solar there is a lot of fiddly soldering to complete. Now would you realise why it is better to buy tabbed cells?

Now to another action, connecting your tabbed mobile to its mate, the next cell. Fundamentally you will be soldering the free end associated with the top "sunny-face" tabbing strip to your base of this next mobile and repeating the process down your string. Therefore, if you would not lay your cells out according to your panel design, (e.g. 3 strings of 8 cells), or whatever your design will be, do that now. Keep a little room of about 1centimeter between each of them. It's a idea that is good draw a template on some cardboard or Masonite to help keep the strings neat and match the dimensions of your array field.
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The entire process of manufacturing printed circuit boards follows the actions below for many applications:

Basic Steps for Production Printed Circuit Boards:

1. Setup - the entire process of determining materials, procedures, and needs to satisfy the consumer's requirements for the board design on the basis of the Gerber file information supplied with the purchase purchase.

2. Imaging - the process of transferring the Gerber file information for a layer onto an etch resist film that is positioned on the conductive copper layer.

3. Etching - the standard process of exposing the copper along with other areas unprotected by the etch resist movie up to a chemical that eliminates the unprotected copper, leaving the protected copper pads and traces in spot; more recent procedures use plasma/laser etching as opposed to chemicals to eliminate the copper product, allowing finer line definitions.

4. Multilayer Pressing - the entire process of aligning the conductive copper and insulating dielectric layers and pushing them under heat to trigger the adhesive in the dielectric layers to form a board material that is solid.